It appears that Qualcomm’s next high-end chipset will be Snapdragon 845. SoC appeared on the company’s Web site last week but without revealing any details about the platform. Now we have the first leak that indicates that this chipset will bring a considerable advance compared to Snapdragon 835.
The table below shows details not only of the Snapdragon 845 but also of the Kirin 970 that must equip the Huawei Mate 10 at the end of the year. What we see is that both chipsets will be quite powerful and economical thanks to the advanced 10nm manufacturing process. What changes is that the Qualcomm model will be produced by Samsung and Huawei by TSMC.
The Snapdragon 845 will feature the second generation 10nm by Samsung which promises to offer a reduction of up to 15% in consumption compared to the first chipsets manufactured under this type of lithography.
The processor will continue with eight processing cores but debuts the new ARM Cortex-A75 to deliver higher performance compared to the Snapdragon 835’s Cortex-A73. The second quad-core will continue with the ever-present Cortex-A53, Consumption. In GPU we will have the new Adreno 630.
The Snapdragon 845 will come with an X20 modem capable of up to 1.2Gbps data transfer speed, 802.11bh Wi-Fi support, LPDDR4X RAM, UFS 2.1 and dual camera up to 25 MP. According to the leak, the novelty will come in early 2018, which coincides with rumors that Samsung and Qualcomm were developing the chipset for the Galaxy S9.
HiSilicon’s next high-end chipset will come with octa-core CPU, even dual-cluster standard, consisting of the quad-core block with Cortex-A73 and another quad-core with Cortex-A53. The Kirin 970 will also have a modem capable of reaching 1.2 Gbps and comes with the same memory standard: LPDDR4X and UFS 2.1.
It is good to remember that this information is not official. In this way, Snapdragon 845 may be different from what has seen above. Either way, it’s quite likely that we will not see chipsets made in 7nm in early 2018.