Still in late 2016 came the news that the Meizu MX7 smartphone would be the first of the company with Helio X30 chipset, MediaTek solution that will be manufactured under advanced process in 10nm. Today, we’re looking at the new specs of the chipset Helio P30 by MediaTek.
Last month we had new information claiming that Meizu would be considering leaving the Helio X30 aside and adopting the Snapdragon 660, which was recently officiated by Qualcomm. But it seems that the Chinese manufacturer should continue to invest in MediaTek, as GizChina points out.
However, instead of the powerful Helio X30, it is said that Meizu would be watching the as yet unannounced Helio P30, which will be manufactured by TSMC under lithography process at 12nm. The P30 will be a direct rival of the Snapdragon 660 and promises to offer the optimal balance between firepower and power consumption.
MediaTek Helio P30: Specifications
The Helio P30 will feature an octa-core processor, four Cortex-A72s with a maximum speed of 2 GHz and four Cortex-A53s with a maximum speed of 1.5 GHz. Like the rival of Qualcomm, the MediaTek model will support memories LPDDR4 and UFS 2.0. Novelty can be incorporated into devices with a camera up to 25 megapixels.
The new mid-range chipset from MediaTek also promises high download speed thanks to the Cat. 10 LTE modem with a maximum bandwidth of 600 Mbps. If the MX7 really is the first smartphone to bring the Helio P30, then the novelty of Meizu will be aimed at premium intermediaries that offer near-flagship performance, but at a considerably lower cost.